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This Government Contract opportunity from Department Of Defense was posted on August 18, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Secure Component Design (Chiplets/ASICs)

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

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This subcontract opportunity with the Department of the Army involves the design and manufacture of purpose-built microelectronic components, specifically chiplets and ASICs, for prime contractors working on Army DEVCOM AvMC projects. The primary objective is to develop components that provide enhanced trust and security for co-packaged electronics through the use of specialized ASIC design tools and wafer fabrication facilities. A critical requirement for this engagement is domestic fabrication compatibility to ensure the secure delivery of the final chiplets or ASICs. Interested parties should note that the response deadline is September 16, 2026, and the work falls under NAICS code 334413.

General Info

Army subcontract for secure microelectronic chiplets and ASICs; domestic fabrication required by 2026.

Agency

Department Of Defense → Department Of The Army

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of W52P1J26R0001.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Department Of The Army
ContactsNo contacts available
OfficeN/A
Organization / AgencyDepartment Of Defense → Department Of The Army
Office AddressN/A
ContactsNo contact information available

Full Description

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Designs and manufactures purpose-built microelectronic components for prime contractors on Army DEVCOM AvMC projects. Develops chiplets, ASICs, and other components to provide enhanced trust and security for co-packaged electronics using ASIC design tools and wafer fabrication facilities. Requires domestic fabrication compatibility. Delivers secure chiplets or ASICs.

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Earlier notices in this NAICS code

Posted before this notice, open and closed

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CLOSED

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DEADLINE

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2 months ago

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