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Secure Packaging and Assembly of Microelectronics

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract requires the secure die attach, wire bonding, hermetic sealing, and packaging of high-reliability microelectronics within certified facilities to meet stringent defense standards. The work must be performed at a designated location in LINDA, with all processes adhering to strict security and quality protocols to ensure the integrity and performance of critical microelectronic components. The contract is classified as a subcontract and falls under NAICS code 334416, indicating specialized electronic component manufacturing. The solicitation was posted on June 26, 2026, with a firm response deadline of July 27, 2026, at 9:00 PM. The awarding agency is the Defense Microelectronics Activity under the Department of Defense, which underscores the mission-critical nature of the work and the necessity for compliance with federal security and manufacturing requirements. No set-aside provisions or additional organizational type details are specified, and the place of performance is limited to the designated site without additional address details provided.

General Info

Secure microelectronics packaging under defense standards at LINDA facility by July 27, 2026.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

334416 - Capacitor, Resistor, Coil, Transformer, and Other Inductor ManufacturingView NAICS

Place of Performance

LINDA, CA, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Microelectronics Activity
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Office AddressN/A
ContactsNo contact information available

Full Description

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Perform secure die attach, wire bonding, hermetic sealing, and packaging of high-reliability microelectronics in certified facilities.

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