This Government Contract opportunity from Department Of Defense was posted on June 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Secure Packaging and Assembly of Microelectronics
Contract Overview
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The contract requires the secure die attach, wire bonding, hermetic sealing, and packaging of high-reliability microelectronics within certified facilities to meet stringent defense standards. The work must be performed at a designated location in LINDA, with all processes adhering to strict security and quality protocols to ensure the integrity and performance of critical microelectronic components. The contract is classified as a subcontract and falls under NAICS code 334416, indicating specialized electronic component manufacturing. The solicitation was posted on June 26, 2026, with a firm response deadline of July 27, 2026, at 9:00 PM. The awarding agency is the Defense Microelectronics Activity under the Department of Defense, which underscores the mission-critical nature of the work and the necessity for compliance with federal security and manufacturing requirements. No set-aside provisions or additional organizational type details are specified, and the place of performance is limited to the designated site without additional address details provided.
General Info
Agency
NAICS
Place of Performance
LINDA, CA, USASet-Aside
Documents
This scope was carved out of HQ072726RE001.
The full solicitation package (13 documents), including the RFP, is on the prime solicitation, not on this scope.
Rapid Assured Access (R2A)
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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