This Government Contract opportunity from Department Of Defense was posted on June 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Sheet Metal Stamping, Forming, and Bending
Contract Overview
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AI Contract Overview
The contract involves the production of sheet metal enclosures through stamping, forming, and bending operations using progressive dies, focused on high-volume manufacturing requirements. The work will be performed at a facility with a zip code of 95652, aligning with the Defense Microelectronics Activity under the Department of Defense, indicating a defense-related application requiring precision and reliability. The North American Industry Classification System code 332321 confirms the scope within metal stamping and forming services, and the contract is classified as a subcontract, suggesting it supports a larger prime contract or program. Performance is expected to meet stringent quality and volume standards consistent with military or aerospace specifications. The solicitation was posted on June 23, 2026, with a response deadline of July 4, 2026, providing a narrow window for qualified manufacturers to submit proposals. The absence of a set-aside designation and specific point of contact suggests the opportunity is open to all eligible subcontractors without preferential treatment for small, minority, or disadvantaged businesses. Interested parties must demonstrate capability in high-speed progressive die operations and experience producing complex sheet metal components under tight tolerances for defense applications. The lack of location details for the agency may indicate decentralized oversight, but the performance location is fixed, requiring contractors to operate within the specified geographic area.
General Info
Agency
NAICS
Place of Performance
CA, 95652, USASet-Aside
Documents
This scope was carved out of HQ072726SCB01.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Case Re-Manufacturing
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → Defense Microelectronics Activity
Same awarding agency
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