This Government Contract opportunity from National Aeronautics And Space Administration was posted on June 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Specialized Packaging and ESD-Safe Handling
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
This contract involves the specialized packaging and handling of finished FPGA boards to ensure protection from electrostatic discharge (ESD) damage. The scope includes using ESD-safe materials and adhering to procedures that prevent electrostatic damage during packaging, which is critical for maintaining the integrity and functionality of the electronic components. The work is categorized under NAICS code 561990 and is issued by the NASA Shared Services Center, part of the National Aeronautics and Space Administration. The contract is a subcontract with a posted date of June 2, 2026, and a response deadline two days later on June 4, 2026. Specific details about the place of performance and points of contact are not provided. This opportunity aims to secure specialized expertise in handling sensitive electronic products within the aerospace sector, highlighting the importance of protective packaging to meet strict quality and safety standards.
General Info
Agency
NAICS
Place of Performance
MSSet-Aside
Documents
This scope was carved out of 80NSSC26934342Q.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
PCB board fabrication and assembly
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from National Aeronautics And Space Administration → NASA Shared Services Center
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