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Vehicle Recompete: Bpa HQ072723A0802

Active
Federal

Contract Overview

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This Blanket Purchase Agreement, managed by the Defense Microelectronics Activity for the Department of Defense, focuses on the fabrication, assembly, testing, and validation of printed circuit boards and microelectronics. The contract has an IDV ceiling of 1,200,000 dollars and an ordering period that extends through June 7, 2026. The scope of work includes the operation of facilities required to build and evaluate microelectronics, with previous task order activity involving American Computer Development, Incorporated. This vehicle is currently classified as likely to be recompete with a medium confidence level.

General Info

BPA contract up to $1.2M for PCB fabrication and microelectronics, valid until June 2026.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

0

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Bpa vehicle HQ072723A0802 ordering period ends 2026-06-07T00:00:00.000Z. 0 active task orders valued at $0.
Printed circuit boards (pcbs) to fabricate, assemble, build, test, evaluate, verify, validate, and provide microelectronics and/or operate such a facility. IDV Ceiling: $1,200,000 Contracting Office: Defense Microelectronics Activity Agencies: Department of Defense Classification: recompete-likely (Confidence: medium - 50/100)
Top task orders by value: - PRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS. ($103,636.15) - AMERICAN COMPUTER DEVELOPMENT, INCORPORATED

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