Advanced Multi-Chip Packaging Techniques

This subcontract opportunity, titled Advanced Multi-Chip Packaging Techniques, is issued by the Department of the Army for projects under the DEVCOM AvMC. The primary objective is the implementation of advanced 2.5D and 3D packaging processes designed to provide inherent component security for prime contractors. These techniques are specifically intended to prevent unauthorized access and tampering, ensuring the delivery of securely packaged multi-chip assemblies. The project requires that all packaging processes be compatible with domestic standards. Interested parties should note that the solicitation was posted on August 18, 2026, with a response deadline of September 16, 2026. The work falls under NAICS code 334413, focusing on the specialized manufacturing of semiconductor and related electronic assemblies.