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This Government Contract opportunity from Department Of Defense was posted on May 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Electronic Module Repair and Reassembly Services

Closed
Federal

Contract Overview

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This contract involves comprehensive repair, testing, and inspection services for military electronic modules to restore them to a Ready for Issue (RFI) condition. The work encompasses disassembly, thorough cleaning, component-level repair, reassembly, and functional testing of the units to ensure they meet operational standards. The services are aimed at maintaining the readiness and reliability of critical defense electronic equipment. Issued by the Department of Defense through the Navsup Weapon Systems Support agency, the contract is identified as a subcontract opportunity with an NAICS code of 811212, which relates to electronic equipment repair. The solicitation was posted on May 4, 2026, with a response deadline of June 4, 2026. Although specific location details and points of contact are not provided, the contract emphasizes the restoration and maintenance of military modules, indicating its vital role in supporting defense readiness and weapon system sustainability.

General Info

Repair, testing, and inspection of military electronic modules to ensure operational readiness and reliability.

Agency

Department Of Defense → Navsup Weapon Systems Support

NAICS

Place of Performance

PA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Navsup Weapon Systems Support
Office AddressN/A
ContactsNo contact information available

Full Description

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Complete repair, testing, and inspection of military electronic modules to restore units to Ready for Issue (RFI) condition, including disassembly, cleaning, component-level repair, reassembly, and functional testing.