This Government Contract opportunity from Department Of Defense was posted on May 7, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Electrostatic Discharge (ESD) Protection Packaging
Contract Overview
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AI Contract Overview
The contract requires the design and implementation of electrostatic discharge safe packaging specifically for repaired circuit card assemblies, with strict adherence to the ANSI/ESD S20.20-2021 standard. This effort is critical to ensuring the integrity and functionality of sensitive electronic components during handling, storage, and transportation, as any failure in ESD protection could lead to irreversible damage. The packaging solution must be engineered to meet or exceed industry requirements for static dissipation, shielding, and material compatibility, while also enabling efficient workflow integration in repair and logistics environments. This is a subcontract under the Department of Defense, managed by theNavsup Weapon Systems Support Mech, with a highly compressed timeline requiring full proposal submission by May 8, 2026 at 8:30 PM. The North American Industry Classification System code 541715 indicates the work falls under scientific research and development services, emphasizing the technical and engineering rigor expected. While specific performance location and point of contact details are not provided, the urgency of the deadline and the critical nature of ESD compliance suggest the solution must be rapidly deployable and fully validated prior to implementation.
General Info
Agency
NAICS
Place of Performance
PASet-Aside
Documents
This scope was carved out of N0010426QQA30.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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