This Government Contract opportunity from National Aeronautics And Space Administration was posted on July 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD-Compliant Packaging & Delivery Logistics
Contract Overview
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The contract requires precise packaging of printed circuit boards using ESD-safe and moisture-resistant materials to ensure protection against electrostatic discharge and environmental humidity during transit and storage. All units must be securely sealed and labeled according to industry standards for sensitive electronic components, with documentation confirming compliance with ESD control protocols. The delivery must be completed within 20 days of order placement, with the final destination designated as NASA/GSFC, demanding strict adherence to timelines and handling procedures to meet mission-critical requirements. This subcontract, issued under NAICS code 493190 by the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration, has a tight submission window closing just two days after posting, indicating urgency and a highly competitive selection process. The absence of set-aside details and specific geographic information suggests the solicitation is open to qualified vendors nationwide, with performance expectations focused on packaging quality, traceability, and on-time delivery rather than location-based constraints. Failure to meet the 20-day delivery window or packaging specifications could result in rejection or penalties, as the components are intended for use in critical space missions requiring maximum reliability.
General Info
Agency
NAICS
Place of Performance
MSSet-Aside
Documents
This scope was carved out of 80NSSC26939777Q.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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