High-Density Interconnect (HDI) PCB Fabrication

This subcontract involves the fabrication of high-density interconnect raw multi-layer printed circuit boards to support AFLCMC/ESGK-R Strategic Ground Sensors projects for the Department of Defense. The scope of work includes specialized manufacturing processes such as layer registration, drilling, plating, etching, and surface finish application. The contractor is required to utilize high-layer count equipment and work with specialized substrates, including FR-4 and Polyimide, to deliver unpopulated, fabricated PCB blanks. To qualify for this requirement, providers must maintain IPC-A-600 and AS9100 certifications. The contract is categorized under NAICS code 334413 and is associated with the Alcmc Eskc agency. Performance is centered in Warner Robins, with a response deadline set for November 30, 2026. This opportunity is specifically designed for manufacturers capable of meeting rigorous aerospace and defense standards for complex electronic components.