This Combined Synopsis/Solicitation opportunity from Department Of Commerce was posted on November 20, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source
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General Info
Place of Performance
Boulder, CO, 80305, USASet-Aside
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Timeline
Submission Closed
Organization & Contact Information
Full Description
Please see attached Combined Sources Sought Notice (SSN)/Notice of Intent to Sole Source # NIST-SS26-CHIPS-04 for full details.
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