Operando Measurements for Electrochemical Surfactant-Mediated Growth Mechanisms for Interconnect Materials

Obtain technical research support for operando electrochemical measurements of surfactant-mediated metal deposition processes relevant to nanoscale interconnect materials. The Contractor shall support NIST research on the mechanisms of electrochemical deposition of copper and alternative interconnect metals, including rhodium and iridium, using operando measurements and related surface science techniques.The Contractor shall investigate nucleation and growth processes during electrochemical deposition of metals, with emphasis on the impact of co-adsorption and competitive adsorption of additives, suppressors, surfactants, halides, anions, and cations on metal deposition and interfacial structure. The research will be conducted in support of the CHIPS Act project “Electrodeposition of Interconnect Materials and Packaging.”