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Operando Measurements for Electrochemical Surfactant-Mediated Growth Mechanisms for Interconnect Materials

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This contract seeks technical research support for the Department of Commerce to conduct operando electrochemical measurements focused on surfactant-mediated metal deposition processes. The primary objective is to support NIST research into the mechanisms of electrochemical deposition for copper and alternative interconnect metals, such as rhodium and iridium, specifically investigating nucleation and growth processes. A key area of focus involves analyzing how co-adsorption and competitive adsorption of additives, suppressors, surfactants, halides, anions, and cations influence metal deposition and interfacial structure. This initiative is part of the CHIPS Act project titled Electrodeposition of Interconnect Materials and Packaging and will be performed in Gaithersburg, Maryland. The opportunity is designated as a total small business set-aside under NAICS code 541713. Interested parties can coordinate through the point of contact, William Clark, regarding this forecast for laboratory program support.

General Info

Technical research support for NIST electrochemical metal deposition studies under the CHIPS Act.

NAICS

541713 - Research and Development in Nanotechnology

Place of Performance

GAITHERSBURG, MD

Set-Aside

SBA

Documents

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Organization & Contact Information

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AgencyDepartment Of Commerce → AD for Laboratory Programs
Contacts1 person available
OfficeN/A
Office AddressN/A
Contacts
William Clark

Full Description

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Obtain technical research support for operando electrochemical measurements of surfactant-mediated metal deposition processes relevant to nanoscale interconnect materials. The Contractor shall support NIST research on the mechanisms of electrochemical deposition of copper and alternative interconnect metals, including rhodium and iridium, using operando measurements and related surface science techniques.The Contractor shall investigate nucleation and growth processes during electrochemical deposition of metals, with emphasis on the impact of co-adsorption and competitive adsorption of additives, suppressors, surfactants, halides, anions, and cations on metal deposition and interfacial structure. The research will be conducted in support of the CHIPS Act project “Electrodeposition of Interconnect Materials and Packaging.”

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