This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on December 1, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Multiple Award PCB Fab and Assembly BPAs 2026-2030

Awarded

HQ072725QRT04Federal

Submission Closed12/15/2025, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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POSTED

2 days ago

DEADLINE

in 9 days

AI Contract Overview

The contract involves the establishment of multiple Blanket Purchase Agreements (BPAs) with qualified vendors to support the Defense Microelectronics Activity's (DMEA) mission of developing advanced electronics solutions for Department of Defense (DOD) programs. The primary focus is on the rapid production of printed circuit board assemblies (PCBAs) for various stages, including initial design, development, prototype validation, and operational deployment in DOD environments. The solicitation aims to create a competitive pool of small business vendors capable of providing PCB fabrication and assembly services, with each BPA having a maximum ordering ceiling of $7.5 million divided among the qualified offerors. This approach facilitates quick procurement of high-quality electronics products by leveraging industry and commercial PCB manufacturing capabilities. Interested vendors are encouraged to submit proposals by August 15, 2025, with evaluations based on the criteria outlined in the solicitation documents. The contract is set as a total small business set-aside under NAICS code 334418, and the awarded BPAs will be in effect from 2026 through 2030. The overarching goal is to ensure the rapid and reliable procurement of PCBAs to support DMEA’s efforts in addressing obsolescence issues and providing cutting-edge satellite communication solutions for DOD programs. All proposal submissions should be directed to the designated contract specialist, Ryan Tung, via email, with further details available through the provided link.

General Info

DMEA seeks small businesses for PCB fabrication BPAs 2026-2030, total $7.5M ceiling.

Agency

Department Of Defense → Defense Microelectronics Activity

Contract Value

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

CA, USA

Set-Aside

SBA

Awardee

CIRCUIT SPRING, LLC

Award Issued Date

02/26/2026, 12:00:00 AM UTC

Documents

PCB Fabrication and Assembly BPA - HQ072725QRT04

rfp

High

PCB Fabrication and Assembly BPA Re-Solicitation HQ072725QRT04

rfp

High

PWS 25-5E3 - Scope of PCB Requirements

sow

High

AI Contract Breakdown

Uniform Contract Format

Timeline

4 updates

PhaseAwarded

PostedJul 24

Combined Synopsis

Notice updatedJul 25

The notice description changed.

Notice updatedJul 29

Notice details unchanged. Attachments may have changed.

Notice updatedAug 15

Response deadline changed from Aug 15, 2025 to Aug 18, 2025. The notice description changed.

Notice updatedDec 1

Response deadline changed from Aug 18, 2025 to Dec 15, 2025. The notice description changed. The point of contact changed.

AwardedFeb 26

Contract was awarded

Submission Closed

12/15/2025, 08:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Defense Microelectronics Activity

Contacts1 person available

OfficeMCCLELLAN, CA, 956522100, USA

Organization / AgencyDepartment Of Defense → Defense Microelectronics Activity

Office AddressMCCLELLAN, CA, 956522100, USA

Contacts

Ryan C Tung

contact@example.gov

Full Description

Re-solicitation of HQ072725QRT04

DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments.

DMEA intends to competitively issue six BPA agreements to offerors based on three factors in the Proposal Instructions and Evaluation Criteria. DMEA anticipate fulfilling orders of Sixty (60) GrimWing units and Sixty (60) DireWing units using the BPAs.

Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, and the proposal
instructions and evaluation criteria. Phase I proposals are due to the contract specialist, Ryan Tung via e-mail to contact@example.gov, no later than 12:00pm (Pacific), Monday, 15 December 2025.