Notice of Intent to Increase Ceiling on N66001-17-C-4027
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The contract involves a Notice of Intent to increase the ceiling of an existing agreement with Intrinsix Corp., originally awarded on April 19, 2017, by SSC Pacific on behalf of DARPA’s Microsystems Technology Office (MTO). The initial contract supports the DARPA MTO CHIPS program, focusing on developing and evaluating 3D integration and chiplet-based integrated circuit designs, including standardizing architectures for interconnects, EDA tool flows, and building an initial chiplet portfolio. This increase in the contract ceiling, amounting to approximately $400,892, is intended to extend efforts applying lessons learned from the CHIPS program to develop a demonstration system aligned with the Reconfigurable Imaging (ReImagine) program. The ReImagine program targets the realization of multi-functional, software-reconfigurable imaging sensors using 3D chiplet integration methodologies. The contract supports research and development activities under NAICS code 541712 and maintains the original 12-month performance period with an additional 6-month option. Due to the unpredictable nature of R&D, DARPA could not initially project the full extent of required efforts, prompting this ceiling increase without an extension of performance time. This notice is not an invitation for competitive proposals, but interested parties may submit written comments to the designated contract specialist. The government retains sole discretion in deciding whether to open competition based on any feedback received during the 15-day posting period.
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