This Government Contract opportunity from Department Of Defense was posted on August 24, 2017. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Common Heterogeneous Integration & IP Reuse Strategies Support Technologies

Awarded

DARPA-BAA-16-62Federal

Submission Closed08/24/2017, 12:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 541715

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Solicitation # FA875023S7006

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FA8750 Afrl Rik

POSTED

about 18 hours ago

DEADLINE

in almost 2 years

AI Contract Overview

The Common Heterogeneous Integration and Intellectual Property Reuse Strategies (CHIPS) program, managed by the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office, aims to develop the design tools and integration standards necessary for modular integrated circuit designs. By leveraging a combination of Department of Defense and commercial technologies, the program focuses on three primary technical areas: Modular Digital Systems, Modular Analog Systems, and Supporting Technologies. With an anticipated total funding of 70 million dollars, the initiative seeks to establish a framework for the reuse of intellectual property to enhance the efficiency and capability of IC designs. Administered under solicitation DARPA-BAA-16-62, the program requires comprehensive proposals that detail technical approaches, interface standards, team organization, and risk mitigation strategies. Proposers must adhere to strict compliance guidelines, including the submission of detailed cost volumes, labor basis-of-estimates, and bill-of-materials to ensure financial transparency and accountability. The program's structure emphasizes a rigorous selection process involving initial abstracts and full proposals to identify the most viable strategies for advancing heterogeneous integration.

General Info

Agency

Department Of Defense → Defense Advanced Research Projects Agcy

Contract Value

$1,868,803

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

VA, USA

Set-Aside

NONE

Awardee

THE BOEING COMPANY

Award Issued Date

08/22/2017, 12:00:00 AM UTC

Documents

DARPA BAA 16-62 Attachment 1: Proposer Checklist

proposer-checklist

High

DARPA-BAA-16-62 Attachment 2 Proposal Summary Chart CHIPS

specifications

High

DARPA-BAA-16-62: Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)

rfp

High

AI Contract Breakdown

Uniform Contract Format

Contract not broken down yet

CLEATUS splits the solicitation into Uniform Contract Format (UCF) sections: scope, pricing, deliverables, and evaluation criteria.

Timeline

4 updates

PhaseAwarded

PostedSep 29

Presolicitation

Notice updatedNov 22

Response deadline changed from Dec 16, 2016 to Jan 13, 2017. The notice description changed.

Notice updatedNov 22

The notice description changed.

Notice updatedDec 21

The notice description changed.

Notice updatedDec 21

The notice description changed.

AwardedAug 22

Contract was awarded

Submission Closed

08/24/2017, 12:00:00 AM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

Contacts1 person available

OfficeARLINGTON, VA, 222032114, USA

Organization / AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

Office AddressARLINGTON, VA, 222032114, USA

Contacts

Daniel Green

contact@example.gov

Full Description

Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document. Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document. Original Synopsis Below. The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.