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This Government Contract opportunity from Department Of Defense was posted on July 16, 2014. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Purchase of a Disco Model DFD6341 Fully-Automatic Dicing Saw.

Awarded
HQ0727-14-R-0018Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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General Info

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

4234 54th Street, MCCLELLAN, CA, 95652-2100, USA

Set-Aside

NONE

Documents

1
PDF, Low priorityjustification-and-authorization
Low

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Timeline

1 update
PhaseAwarded
Posted

Combined Synopsis

Justification (J&A)

Justification & Approval published

Awarded

Contract was awarded

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
Contacts1 person available
OfficeMCCLELLAN, CA, 956522100, USA
Office AddressMCCLELLAN, CA, 956522100, USA
Contacts

Full Description

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This is a combined synopsis/solicitation for commercial services prepared in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. Quotations shall be valid for a minimum of 60 days. This announcement constitutes the solicitation. The NAICS Code is 334413 with a size standard of 500 employees. The request for quote (RFQ) reference number is HQ0727-14-R-0018. The Requirement for this task is to purchase a Disco Model DFD6341 Fully Automatic Wafer Dicing Saw and options. The government's intended source for this specialized saw is Disco Hi -Tec America, 3270 Scott Blvd, Santa Clara, Ca 95054-3011 All responsible sources may submit a capability statement quotation which shall be considered by the agency. The place of performance is Defense Microelectronics Activity (DMEA), 4234 54th St, McClellan, CA 95652. The Disco Model DFD6341 Fully-Automatic Dicing Saw replaces current wafer dicing saw is over 14 years old and has reached an end of life support by the manufacturer. Replacement parts for this tool are no longer being manufactured and have become obsolete and/or unavailable. If the wafer saw fails and no replacement components are available, there is a high risk of not meeting production requirements. A lot of time and effort has been spent developing processes and recipes with the current tool. These processes and recipes can and will be transferred to the new equipment saving DMEA training time, process development and money. The DFD6341 Dicing Saw will be a form fit function replacement to the current obsolete tool and will not adversely impact the current process line as well as require additional lab space/construction. Copies of the Statement of Work (SOW) and complete requirements are attached. This solicitation and incorporated provisions and clauses are those in effect and current to FAR Federal Acquisition Circular (Fac) 2005-73 and DFARS DPN 2 20140506. The following FAR clauses apply: 52.212-1 Instructions to Offerors-Commercial Items; 52.212-2, Evaluation-Commercial Items; 52.212-3 Offeror Representations and Certifications-Commercial Items; 52.212-4 Contract Terms and Conditions-Commercial Items; 52.212-5 Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items with clauses 52.204-10, 52.209-6, 52.219-8, 52.219-28, 52.223-3, 52.222-21, 52.222-26, 52.222-35, 52.222-36, 52.222-37, 52.222-40, 52.222-51, 52.222-54, 52.223-18, 52.225-13, 52.232-33; 52.232-40 and DFARS clauses that apply 252.203-7000, 252.204-7012, 252.204-7015, 252.223-7008, 252.225-7001, 252.227-7015, 252.232-7003, 252.232-7010, and 252.244-7000. Questions regarding this solicitation should be emailed to the contracting POC, Ed Kurjanowicz at contact@example.gov. DMEA greatly appreciates your Quotes.

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Software Publishers

POSTED

5 days ago

DEADLINE

in 3 days
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