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This Government Contract opportunity from Department Of Defense was posted on June 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Reverse Engineering & 3D CAD Modeling for Sheet Metal Enclosures

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 541330
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NAICS: 541330
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POSTED

about 5 hours ago

DEADLINE

in 17 days
NAICS: 541330
New
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POSTED

about 17 hours ago

DEADLINE

in about 1 month

AI Contract Overview

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The contract involves reverse engineering existing sheet metal enclosures to produce precise 3D CAD models that will be used to support tooling development and manufacturing processes. This work requires detailed analysis of physical components to accurately capture dimensions, geometries, and tolerances, ensuring that the digital models are fully functional and ready for production use. The objective is to enable efficient replication or modification of enclosures without access to original design documentation, making the project critical for sustaining legacy systems or transitioning to modern manufacturing methods. The effort is categorized under NAICS code 541330, indicating it falls under engineering services, and is issued as a subcontract by the Defense Microelectronics Activity under the Department of Defense. Performance is required at a location with ZIP code 95652, suggesting the work must be conducted in or near that geographic area. Responses are due by July 4, 2026, and the solicitation was posted on June 23, 2026, indicating a limited window for qualified vendors to submit proposals. No set-aside designation or point of contact information is provided, implying the contract is open to all eligible subcontractors without preference.

General Info

Reverse engineer sheet metal enclosures into 3D CAD models for manufacturing at ZIP 95652 by July 4, 2026.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

541330 - Engineering ServicesView NAICS

Place of Performance

CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072726SCB01.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Case Re-Manufacturing

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Microelectronics Activity
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Reverse engineer existing sheet metal enclosures and develop accurate 3D CAD models to support tooling and manufacturing.

More opportunities from Department Of Defense → Defense Microelectronics Activity

Same awarding agency

NAICS: 334417
SBIR / STTR
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The Cable Connector Enhancement solicitation, numbered DME26TZ05-NP001 and issued by the Defense Microelectronics Activity under the Department of Defense, seeks an innovative and versatile solution to address failure-prone cable-to-board connections in electronics systems. Current methods, such as potting or Hot Bar Soldering, are often limited by mechanical constraints, high rework risks, or the need for assembly-specific tooling. The goal is to develop a more efficient method for maintaining reliable electrical connections in stressful environments, particularly for existing designs where full board redesigns are cost-prohibitive. This effort is structured as a Small Business Technology Transfer (STTR) program, set aside for total small businesses with fewer than 500 employees. The procurement process follows a trade-off basis, evaluating proposals based on technical merit, the qualifications of key personnel, and commercialization potential. Phase I typically lasts 6 to 12 months, with a potential transition to a 24-month Phase II. Proposals must be submitted via the Defense SBIR/STTR Internet Portal by September 23, 2026. Requirements include strict adherence to Cybersecurity Maturity Model Certification (CMMC) standards, full disclosure of foreign affiliations, and compliance with ITAR/EAR export controls. Awarded contracts will utilize Wide Area WorkFlow for invoicing and are subject to government inspection and acceptance at the destination.
Electronic Connector Manufacturing

POSTED

about 1 month ago

DEADLINE

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View Details
NAICS: 334418
SBIR / STTR
Additive Manufacturing for Flexible Electronics
Solicitation # DME26BZ05-NV001
The Defense Microelectronics Activity, under the Department of Defense, is soliciting Phase I feasibility studies for additive manufacturing of flexible electronics to support high-mix, low-volume manufacturing. The objective is to validate 3D printing methods for electronics packaging and assembly, specifically targeting the development of prototypes comparable to Radio Frequency multichip modules. Key technical goals include achieving printed trace widths of 5 mil or better, supporting 12x12 BGA with 0.5mm ball pitch, and ensuring thermal resilience up to 150 degrees Celsius. The effort seeks to reduce costs and manufacturing timelines by utilizing vat photopolymerization, aerosol jet printing, and integrated printed passives while establishing reliability data based on MIL-STD quality metrics. This solicitation, numbered DME26BZ05-NV001, is a total small business set-aside under NAICS code 334418, with a response deadline of September 23, 2026. Proposals must be submitted via the Defense SBIR/STTR Innovation Portal and are evaluated based on technical merit, investigator qualifications, and commercialization potential using a trade-off process. Awardees must comply with strict cybersecurity requirements, including CMMC Level 2 certification and NIST SP 800-172 standards. The contract is structured as a fixed-price research and development effort, requiring detailed technical and cost volumes, full disclosure of foreign affiliations, and adherence to specific small business work-performance percentages.
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