RFP-LPP-270000000043-1 | Lincoln Park Middle School Technology

Lincoln Park Public Schools is soliciting sealed bids for the Lincoln Park Middle School Technology project, identified as LPPS Bid Package T-002 and IDS Project No. 26122-1001. This procurement, falling under NAICS code 236220, involves renovations and additions to the Lincoln Park Middle School as part of the 2026 Technology Bond. The work will be performed at the school located in Lincoln Park, Michigan. Interested parties must submit their sealed bids to Lincoln Park Public Schools at 1650 Champaign Rd, Lincoln Park, Michigan 48146, by 2:00 PM local time on November 2, 2026. To be considered, all submissions must include a sworn and notarized Familial Relationship Disclosure Statement and an Iran Sanctions Affidavit of Compliance. Failure to provide the notarized disclosure statement will result in the Board of Education rejecting the bid. The primary point of contact for this solicitation is Matthew Miller.