MODULAR DEVICES INC

Modular Devices Inc. specializes in the design, development, and manufacturing of precision electronic components and subsystems, leveraging its expertise in semiconductor device fabrication and modular system integration. As a manufacturer operating under NAICS 334413, the company focuses on producing custom electronic assemblies, printed circuit boards, and embedded control systems tailored for mission-critical applications. Their technical capabilities include surface-mount technology, high-reliability soldering, thermal management design, and compliance with military and aerospace environmental standards. The firm emphasizes modularity in product architecture, enabling rapid reconfiguration and scalability for evolving system requirements. While no specific award history is available to confirm project details, their core competency lies in translating complex engineering specifications into ruggedized, field-deployable electronic hardware. No agency relationships can be inferred due to insufficient award data. The company’s market positioning is centered on the defense, aerospace, and industrial control sectors, where reliable, compact electronic systems are essential. Their production processes likely support applications requiring extended lifecycle support, EMI shielding, and compliance with MIL-STD-810 or IPC-A-610 standards. Modular Devices Inc. is a small business structured as a 2L entity, indicating a limited operational footprint with localized production capabilities based in Shirley, New York. The company does not hold any formal government certifications such as 8(a), HUBZone, or WOSB. Its geographic presence is confined to its New York facility, suggesting a niche, hands-on manufacturing model rather than a nationwide service provider. The business operates as a specialized supplier within the federal electronics supply chain, prioritizing quality control and customization over scale.