This Government Contract opportunity from National Aeronautics And Space Administration was posted on August 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Non-Recurring Engineering for PIC Packaging Process Development

Closed

Federal

Submission Closed08/12/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 541715

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U.S. Navy

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about 10 hours ago

DEADLINE

in 28 days

AI Contract Overview

This subcontract, issued by the NASA Shared Services Center, focuses on Non-Recurring Engineering for the development of specialized photonic integrated circuit packaging processes. The scope of work involves the creation and implementation of custom photonic packaging techniques, specifically emphasizing UV index matching, the establishment of active alignment procedures, and comprehensive validation of these processes. The project is categorized under NAICS code 541715, reflecting its nature as research and experimental development in the physical sciences. Interested parties should note the tight turnaround for this opportunity, with a posting date of August 10, 2026, and a response deadline of August 12, 2026.

General Info

NASA subcontract for photonic integrated circuit packaging development and validation processes.

Agency

National Aeronautics And Space Administration → NASA Shared Services Center

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

Set-Aside

NONE

Documents

This scope was carved out of 80NSSC26939631Q.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.