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3D DIC System One pair of cameras, Lighting, Software

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Department of Commerce is seeking to acquire a High-Performance 3D DIC System, including a pair of cameras, lighting, and software, to be utilized by the Infrastructure and Materials Group in Gaithersburg. This equipment will feature integrated environmental chambers designed for non-contact optical measurements of semiconductor packages. The acquisition supports the CHIPS R&D Metrology Program and Grand Challenge 3, focusing on the characterization of advanced packaging integration and the creation of open-source reliability tools. By enabling the precise measurement of warpage and strain in critical components such as redistribution layers, underfills, and thermal interface materials, the system aims to enhance reliability design efficiency. This investment is intended to reduce development costs and timelines for United States manufacturers within the semiconductor ecosystem. The procurement is categorized under NAICS code 334413 and is currently listed as a forecast.

General Info

Commerce seeks a 3D DIC System for semiconductor packaging measurements in Gaithersburg.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD, USA

Set-Aside

NONE

Documents

0

No documents available

Documents will appear here when they are available.

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forecast

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Organization & Contact Information

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AgencyDepartment of Commerce
Contacts2 people available
OfficeN/A
Organization / Agency
Department of Commerce
Office AddressN/A
Contacts
NATHALI CLARK
contact@example.gov
DOC OSDBU
contact@example.gov

Full Description

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The Infrastructure and Materials Group requires the acquisition of a High-Performance 3D DIC System with integrated environmental chambers to perform non-contact optical measurements of semiconductor packages. This acquisition is directly aligned with the CHIPS R&D Metrology Program’s mission to advance measurement science for the semiconductor ecosystem, specifically supporting Grand Challenge 3 by enabling the characterization of advanced packaging integration and providing new open-source reliability tools. By providing the semiconductor industry with accurate warpage and strain data for sensitive, highly critical components like polymeric advanced packaging (e.g. underfills, redistribution layers, and thermal interface materials), this investment will significantly improve reliability design efficiency and reduce development time and costs for US manufacturers.This equipment is critical to achieving the project's mission of deve

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