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Quanta SEM (Service)

Active
Federal

Contract Overview

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The Quanta SEM service project, managed by the Department of Commerce and based in Gaithersburg, focuses on addressing manufacturing challenges related to the heterogeneous integration of modular chips in system-in-package designs. The primary objective is to mitigate thermal management issues and mechanical incompatibilities across various package interfaces and building blocks. To achieve this, the project will utilize indentation and scanning probe-based measurements to analyze process-induced alterations in the thermo-mechanical properties of advanced packaging materials. By leveraging extensive expertise in nanoscale and microscale mechanical property measurements, the initiative aims to develop and deliver improved measurement methodologies and critical data to industry partners. This effort is intended to enhance predictive manufacturing capabilities for microelectronic materials. The project is categorized under NAICS code 334413 and is currently listed as a forecast.

General Info

Commerce project analyzing chip packaging thermo-mechanical properties to improve microelectronic manufacturing capabilities.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD, USA

Set-Aside

NONE

Documents

0

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Timeline

Posted

forecast

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Organization & Contact Information

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AgencyDepartment of Commerce
Contacts2 people available
OfficeN/A
Organization / Agency
Department of Commerce
Office AddressN/A
Contacts

Full Description

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Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and mechanical incompatibilities among the various interfaces and building blocks of the package. This project will provide indentation and scanning probe-based measurements for the process-induced alterations of the thermo-mechanical properties of materials and structures used in advanced packages. Building on our decades-long expertise in nanoscale to microscale mechanical property measurements on microelectronic materials, we will improve and deliver measurement methodologies and data to industry to enhance their predictive manufacturing.

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