FY24 Microelectronics Commons Call for Projects – Project Year 3

MEC: Updated RFP – posted 13 August 2026 Full proposals are due by 12:00pm ET on 10 September 2026. All submissions will use the FY24 Microelectronics Commons Call for Projects – Project Year 3 – Submit a Proposal Function. Project Background Microelectronics Commons is a Department of War (DoW) national network for onshore, microelectronics hardware-focused prototyping, laboratory to fabrication (lab-to-fab) transition of semiconductor technologies and semiconductor workforce training. In 2023, the DoW established the Microelectronics Commons – a network of eight regional Hubs to evolve laboratory prototypes to fabrication prototypes and to strengthen the semiconductor workforce. Annually, Hubs will compete for project awards. These annual project awards may include infrastructure (physical, digital, and human) required to accomplish the proposed prototypes. This Call for Projects (CFP) describes the desired capabilities for which project proposals are being sought. Current State and Desired End-State To accelerate evaluation and ensure alignment with current strategic objectives, Naval Surface Warfare Center, Crane Division is requesting a Technical White Paper and a Price Rough Order of Magnitude (ROM) for this initial and abbreviated request. The request for a full proposal will occur at a later date. FY24 Microelectronics Commons Call for Projects PY3 Microelectronics Commons FY24 Call for Projects PY3 (CFP) Page 3 of 27 The primary objective of this abbreviated RFS is to ensure that the proposed tasking provides immediate, actionable value. Your submission must explicitly tie the project scope to a definitive transition path that supports established Government priorities inclusive of support letters as applicable. 1. Military Impact 2. Future Procurement Opportunities 3. Alignment to Technical Guidance 4. Critical Technology Transition Innovative prototypes to include microelectronics materials, processes, devices, and architectural designs will be supported. Activities executed within Microelectronics Commons shall primarily fall under Budget Activity (BA) 3, although activities that fall under Budget Activities 2 and 4 will also be supported if they are in support of the lab-to-fab prototype (e.g., BA 2 activities may be needed to support iterative development, and BA 4 activities may be needed to support the transition of a project to DoW demonstrators). For further discussion on research, development, testing, and evaluation (RDT&E) budget activities, see the DoD Financial Management Regulation, DoD 7000.14-R, Volume 2B, Chapter 5. (VOLUME_2B (defense.gov). For further discussion on Manufacturing Readiness Levels (MRLs), see the Manufacturing Readiness Level (MRL) Deskbook, Version 2.0. https://www.dodmrl.com For further discussion on Technology Readiness Levels (TRLs), see the Technology Readiness Level (TRL) Deskbook, Version 2.0. https://www.dodmrl.com The end-state goal is microelectronics hardware-focused prototyping and lab-to-fab transition of semiconductor technologies. For lab-to-fab prototyping, the fab prototype must at least match if not exceed lab prototype technical specifications, and there must be a path to manufacturability in a Core (i.e., a foundry or fab). Projects that have been demonstrated in a lab and are ready for prototyping in a fab will have higher priority than lab prototyping projects. For specific technology area current state and desired end-state criteria, view each Call for Projects (CFP) document under the Key Documents section on the right-hand side of the page. Service area interests and capabilities can be found within the Microelectronics Commons Resource Library .