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Raman-PL Microscope

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Department of Commerce is seeking a Raman-PL Microscope to establish a critical measurement infrastructure focused on the manufacturing of reliable devices using 2D and wide-band gap materials. This initiative aims to integrate reliability and provenance assessments early in the electronics development process, addressing current vulnerabilities in electronics used for national security and defense applications. By building this measurement framework, the project intends to facilitate the early adoption of next-generation electronics that utilize 2D materials as functional components. This forecast is categorized under NAICS code 334413 and specifies Boulder as the place of performance. Interested parties can coordinate with Nathali Medina or the DOC OSDBU for further information regarding this procurement effort.

General Info

Department of Commerce seeks Raman-PL Microscope for 2D material electronics measurement in Boulder.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

BOULDER, CO, USA

Set-Aside

NONE

Documents

0

No documents available

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Organization & Contact Information

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AgencyDepartment of Commerce
Contacts2 people available
OfficeN/A
Organization / Agency
Department of Commerce
Office AddressN/A
Contacts
NATHALI MEDINA
contact@example.gov
DOC OSDBU
contact@example.gov

Full Description

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The purpose of this project is to provide the necessary measurement infrastructure to enable high confidence in manufacturing reliable devices containing advanced materials (herein 2D and wide-band gap materials). Reliability and provenance are often not considered early in electronics development, but they are essential steps of advanced electronic systems necessary for national security and defense applications. This project addresses a significant pitfall in electronics for national security that are based on wide-band gap materials and builds out measurement framework for early adoption of next-generation electronics containing 2D materials as functional components.

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