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APXPS spectrometer with differential pumping system and detector

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Federal

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The Department of Commerce is seeking an APXPS spectrometer equipped with a differential pumping system and detector to support the development of a new plasma-XPS metrology platform. This initiative leverages expertise in plasma-surface interaction and operando photoelectron spectromicroscopy to enable quantitative, sub-monolayer sensitive chemical analysis of wafer surfaces, thin films, and interfaces during real-time plasma processing. The project aims to enhance semiconductor process development and inspection toolsets for next-node technology through collaborations with industrial partners and academia. The procurement is listed as a forecast with the place of performance located in Gaithersburg. It falls under NAICS code 334413 and is managed by the Department of Commerce, with coordination provided by the CHIPS office. This effort represents a significant advancement in measurement science intended to improve the monitoring and control of chemical statuses during critical semiconductor manufacturing steps.

General Info

Department of Commerce seeks APXPS spectrometer for semiconductor plasma-XPS metrology platform in Gaithersburg.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD, USA

Set-Aside

NONE

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Timeline

Posted

forecast

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Organization & Contact Information

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AgencyDepartment of Commerce
Contacts2 people available
OfficeN/A
Organization / Agency
Department of Commerce
Office AddressN/A
Contacts

Full Description

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Advanced in situ and operando methods for real time monitoring of the chemical status of wafer surfaces, thin films, and interfaces during plasma processing are essential for semiconductor process development and control. We will build upon NIST's leading expertise in plasma-surface interaction, plasma diagnostics, and operando photoelectron spectromicroscopy to develop a new plasma-XPS metrology platform for quantitative sub-monolayer sensitive in-situ chemical analysis of wafer surfaces during plasma processing. This innovative metrology will be a valuable addition to the next node semiconductor process development and inspection toolset and, in a broader scope, to the fundamental measurement science of plasma-surface interaction. We will collaborate with industrial partners (see letters of support) and academia in the development, implementation, and dissemination of plasma-XPS metrology. The data generated during this project and th

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