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Controller for PIF Bruker Icon

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This project, managed by the Department of Commerce, focuses on establishing a measurement infrastructure to ensure the reliability and provenance of devices utilizing advanced 2D and wide-band gap materials. By addressing critical gaps in early-stage electronics development, the initiative aims to create a robust measurement framework essential for the deployment of next-generation electronic systems used in national security and defense applications. The specific procurement forecast is for a Controller for PIF Bruker Icon, with the place of performance located in Boulder. The project falls under NAICS code 334413 and is coordinated through the Department of Commerce, with primary points of contact including Nathali Medina and the DOC Office of Small and Disadvantaged Business Utilization.

General Info

Department of Commerce procurement for a PIF Bruker Icon Controller in Boulder.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

BOULDER, CO, USA

Set-Aside

NONE

Documents

0

No documents available

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Timeline

PostedAug 21

forecast

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Organization & Contact Information

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AgencyDepartment of Commerce

Contacts2 people available

OfficeN/A

Organization / Agency

Department of Commerce

Office AddressN/A

Contacts

NATHALI MEDINA

contact@example.gov

DOC OSDBU

contact@example.gov

Full Description

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The purpose of this project is to provide the necessary measurement infrastructure to enable high confidence in manufacturing reliable devices containing advanced materials (herein 2D and wide-band gap materials). Reliability and provenance are often not considered early in electronics development, but they are essential steps of advanced electronic systems necessary for national security and defense applications. This project addresses a significant pitfall in electronics for national security that are based on wide-band gap materials and builds out measurement framework for early adoption of next-generation electronics containing 2D materials as functional components.

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