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Mobile, Integrable, Closed Cycle Cryostat (MIC3)

Active
Federal

Contract Overview

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The Department of Commerce is forecasting the acquisition of a Mobile, Integrable, Closed Cycle Cryostat (MIC3) to support metrology research and development under the CHIPS Act. This initiative is part of Grand Challenge 1, which aims to strengthen the U.S. semiconductor industry by improving measurement science related to the purity, properties, and provenance of materials. Specifically, the equipment will be used to evaluate the reliability of wide band gap and two-dimensional materials and devices through the analysis of optical spectroscopy responses. The project will be performed in Gaithersburg and falls under NAICS code 334413. This effort is critical for understanding the robustness of advanced materials and ensuring their successful application within the semiconductor sector. Interested parties may coordinate with the designated point of contact, Nathali Clark, or the Department of Commerce Office of Small and Disadvantaged Business Utilization.

General Info

Commerce seeks a Mobile Integrable Closed Cycle Cryostat for semiconductor metrology research.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD, USA

Set-Aside

NONE

Documents

0

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Timeline

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forecast

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Organization & Contact Information

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AgencyDepartment of Commerce
Contacts2 people available
OfficeN/A
Organization / Agency
Department of Commerce
Office AddressN/A
Contacts

Full Description

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As part of the CHIPS Act, researchers from NIST are actively pursuing a comprehensive program in metrology research and development aimed at bolstering the U.S. semiconductor industry. A pivotal aspect of their strategic objectives is outlined in one of the seven Grand Challenges—specifically, Grand Challenge 1. This challenge focuses on enhancing metrology tools and measurement science dedicated to assessing the Purity, Properties, and Provenance of materials, which are critical for advancing the semiconductor sector.A targeted initiative under this challenge involves the evaluation of the reliability of both two-dimensional (2D) and wide band gap (WBG) materials and devices. This evaluation is crucial for understanding the robustness and potential applications of these advanced materials in the semiconductor industry. To effectively conduct this research, and particularly to analyze the optical spectroscopy responses of materials

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