HT In-situ Indenter

The HT In-situ Indenter project, managed by the Department of Commerce and based in Gaithersburg, focuses on addressing manufacturing challenges associated with the heterogeneous integration of modular chips in system-in-package designs. The primary objective is to mitigate thermal management issues and mechanical incompatibilities across various package interfaces and building blocks. To achieve this, the project will utilize indentation and scanning probe-based measurements to analyze process-induced alterations in the thermo-mechanical properties of advanced packaging materials. By leveraging extensive expertise in nanoscale and microscale mechanical property measurements, the initiative aims to provide the industry with improved measurement methodologies and critical data to enhance predictive manufacturing capabilities.