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Semiconductor Parametric Analyzer

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Department of Commerce is seeking a Semiconductor Parametric Analyzer to establish a critical measurement infrastructure for manufacturing reliable electronic devices. This project focuses on the integration of advanced materials, specifically 2D and wide-band gap materials, to ensure high confidence in device reliability and provenance. By addressing current pitfalls in electronics development, the initiative aims to support the creation of advanced electronic systems essential for national security and defense applications. This forecast identifies the place of performance as Boulder and falls under NAICS code 334413. The project is designed to build a comprehensive measurement framework that facilitates the early adoption of next-generation electronics utilizing 2D materials as functional components. Points of contact for this effort include Nathali Medina and the DOC OSDBU.

General Info

Department of Commerce seeks Semiconductor Parametric Analyzer for advanced electronic device measurement infrastructure.

Agency

Department of Commerce

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

BOULDER, CO, USA

Set-Aside

NONE

Documents

0

No documents available

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Organization & Contact Information

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AgencyDepartment of Commerce
Contacts2 people available
OfficeN/A
Organization / Agency
Department of Commerce
Office AddressN/A
Contacts
NATHALI MEDINA
contact@example.gov
DOC OSDBU
contact@example.gov

Full Description

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The purpose of this project is to provide the necessary measurement infrastructure to enable high confidence in manufacturing reliable devices containing advanced materials (herein 2D and wide-band gap materials). Reliability and provenance are often not considered early in electronics development, but they are essential steps of advanced electronic systems necessary for national security and defense applications. This project addresses a significant pitfall in electronics for national security that are based on wide-band gap materials and builds out measurement framework for early adoption of next-generation electronics containing 2D materials as functional components.

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